Growth of a Cu(Co) film by underpotential deposition of Co and controlling the time of the surface-limited redox replacement of Cu
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DOI: 10.20964/2019.06.58
Abstract: Alternating between the underpotential deposition (UPD) of Co and surface-limited redox replacement (SLRR) of Cu enables the growth of a Cu(Co) film in a layer-by-layer manner. The technique is essential for fabricating Cu interconnects in… read more here.
Keywords: surface limited; underpotential deposition; time; deposition ... See more keywords