Accelerated Metastable Solid–liquid Interdiffusion Bonding with High Thermal Stability and Power Handling
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-017-5779-z
Abstract: Emerging high-performance systems are driving the need for advanced packaging solutions such as 3-D integrated circuits (ICs) and 2.5-D system integration with increasing performance and reliability requirements for off-chip interconnections. Solid–liquid interdiffusion (SLID) bonding resulting… read more here.
Keywords: accelerated metastable; liquid interdiffusion; thermal stability; solid liquid ... See more keywords
Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures
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DOI: 10.1007/s11664-020-08530-y
Abstract: Wafer-level solid liquid interdiffusion (SLID) bonding, also known as transient liquid-phase bonding, is becoming an increasingly attractive method for industrial usage since it can provide simultaneous formation of electrical interconnections and hermetic encapsulation for microelectromechanical… read more here.
Keywords: wafer level; liquid interdiffusion; formation; level solid ... See more keywords
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
Sign Up to like & getrecommendations! Published in 2022 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2021.161852
Abstract: Abstract Solid-liquid interdiffusion (SLID) bonding is one of the most promising novel methods for micro-(opto)-electromechanical system (MEMS/MOEMS) wafer-level packaging. However, the current SLID bonding solutions require the use of an electrochemical deposition method for MEMS/MOEMS… read more here.
Keywords: electroplated silicon; contact electroplated; evolution; liquid interdiffusion ... See more keywords
Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils
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DOI: 10.3390/mi13081307
Abstract: Considering the demand for low temperature bonding in 3D integration and packaging of microelectronic or micromechanical components, this paper presents the development and application of an innovative inductive heating system using micro coils for rapid… read more here.
Keywords: rapid solid; solid liquid; heating; liquid interdiffusion ... See more keywords