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Published in 2019 at "Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications"
DOI: 10.1177/1464420718784314
Abstract: The dependences of microstructures on the solidification thermal parameters of Sn–0.5 wt.%Cu, Sn–0.5 wt.%Cu–0.05 wt.%Al, and Sn–0.5 wt.%Cu–0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of…
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Keywords:
eutectic growth;
solders low;
dendritic eutectic;
low alloying ... See more keywords