Fabrication and measurement of 3D LPF based on coaxial TSV
Sign Up to like & getrecommendations! Published in 2019 at "Electronics Letters"
DOI: 10.1049/el.2018.7325
Abstract: The implementation of mainstream passive low-pass filters (LPFs) remains a challenge to satisfy the requirements of small size and compatibility with standard CMOS process. Fortunately, the emerging technology of through-silicon via (TSV) offers a possible… read more here.
Keywords: fabrication measurement; lpf based; measurement; based coaxial ... See more keywords