Network-on-Chip Design Guidelines for Monolithic 3-D Integration
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DOI: 10.1109/mm.2019.2937726
Abstract: Monolithic three-dimensional (M3D) integration is viewed as a promising improvement over through-silicon-via-based 3-D integration due to its greater inter-tier connectivity, higher circuit density, and lower parasitic capacitance. With M3D integration, network-on-chip (NoC) communication fabric can… read more here.
Keywords: m3d integration; integration; m3d; network chip ... See more keywords
A Logic-on-Memory Processor-System Design With Monolithic 3-D Technology
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Micro"
DOI: 10.1109/mm.2019.2944330
Abstract: In recent years, the size of transistors has been scaled down to a few nanometers and further shrinking will eventually reach the atomic scale. Monolithic three-dimensional (M3D) ICs use the third dimension for placement and… read more here.
Keywords: memory; logic memory; m3d; technology ... See more keywords