Multifunctional Epoxy-Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy.
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DOI: 10.1002/smll.202204303
Abstract: The sharp reduction in size and increase in power density of next-generation integrated circuits lead to electromagnetic interference and heat failure being a key roadblock for their widespread applications in polymer-based electronic packaging materials. This… read more here.
Keywords: mdcf ldh; electronic packaging; mdcf; absorption ... See more keywords