Micro-Mechanical In Situ Measurements in Thin Film Systems Regarding the Determination of Residual Stress, Fracture Properties and Interface Toughness
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DOI: 10.1017/s143192761700441x
Abstract: The major trend in microelectronics industry is driven by miniaturization and the increase in functionality [1]. According to root cause analysis from determined failures it is often found that failures in microelectronic components are often… read more here.
Keywords: micro mechanical; situ measurements; mechanical situ; thin film ... See more keywords