Dishing-free chemical mechanical planarization for copper films
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DOI: 10.1016/j.colsurfa.2021.126143
Abstract: Abstract The importance of obtaining a dishing-free Cu-film chemical-mechanical planarization (CMP) has rapidly increased as the line width of Cu-wire integration in advanced semiconductor devices reduced to less than 10 nm. Unlike conventional etching (i.e.,… read more here.
Keywords: mechanical planarization; chemical mechanical; cmp; film ... See more keywords