On the Electrochemical Migration Mechanism of Gold in Electronics—Less Reliable Than Expected?
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DOI: 10.3390/ma14185237
Abstract: Electrochemical migration (ECM) forming dendritic short circuits is a major reliability limiting factor in microcircuits. Gold, which is a noble metal, has been regarded as a metallization that can withstand corrosion and also ECM, therefore… read more here.
Keywords: electrochemical migration; migration mechanism; gold; gold electronics ... See more keywords