Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test
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DOI: 10.3390/en14175532
Abstract: This paper investigates the degradation mechanism of pressure-sintered silver (s-Ag) film for silicon carbide (SiC) chip assembly with a 2-millimeter-thick copper substrate by means of thermal shock test (TST). Two different types of silver paste,… read more here.
Keywords: thermal shock; mechanism; sintered silver; mechanism pressure ... See more keywords