Microstructure evolution and bonding mechanism of Ti2SnC-Ti6Al4V joint by using Cu pure foil interlayer
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DOI: 10.1016/j.matchar.2017.01.035
Abstract: Abstract Ti 2 SnC, as one of functional ceramics with self-healing ability, was studied in welding with Ti6Al4V (TC4) through Cu interlayer under an applied mechanical pressure 10 MPa in Ar atmosphere. Electron probe microanalyses indicated… read more here.
Keywords: evolution bonding; mechanism ti2snc; interlayer; microstructure evolution ... See more keywords