Thermal management of electronic devices using pin-fin based cascade microencapsulated PCM/expanded graphite composite
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DOI: 10.1016/j.ijheatmasstransfer.2019.119199
Abstract: Abstract Microencapsulated phase change material (MEPCM) could be used for effective thermal management of electronic devices due to its large latent heat, phase change at nearly constant temperature, low volume expansion, and anti-leakage characteristics. Unfortunately,… read more here.
Keywords: pin fin; mepcm; pin; heat ... See more keywords