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Published in 2017 at "Journal of Electromagnetic Waves and Applications"
DOI: 10.1080/09205071.2017.1356753
Abstract: Abstract This study proposed a reconfigurable antenna design integrated with the metal frame of tablet computers that can switch between long-term evolution (LTE) and wireless wide area network (WWAN) frequencies. The antenna is installed in…
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Keywords:
metal;
integrated metal;
metal frame;
structure ... See more keywords
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Published in 2024 at "Surface Topography: Metrology and Properties"
DOI: 10.1088/2051-672x/ad4dbd
Abstract: Porous polyimide (PPI) can store oil, but the mechanical properties are also weakened by the pores. To solve this problem, a 3D printed metal frame-PPI nested composite (MFP) was proposed. The composite material has a…
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Keywords:
metal frame;
metal;
printed metal;
porous polyimide ... See more keywords
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Published in 2019 at "IEEE Transactions on Antennas and Propagation"
DOI: 10.1109/tap.2019.2900407
Abstract: In this paper, a novel technique is introduced to reduce the handset metal-frame blockage to the main beam of a millimeter-wave (mm-wave) endfire antenna array. The metal-frame blockage to mm-wave antennas with different polarizations is…
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Keywords:
frame;
array;
metal;
antenna ... See more keywords
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Published in 2025 at "International Journal of Antennas and Propagation"
DOI: 10.1155/ijap/5591517
Abstract: In this paper, the study focuses on metal frame smartphone antennas and presents the implementation of an eight‐port broadband MIMO metal frame antenna array for smartphones. The MIMO antenna operates within a wide frequency band…
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Keywords:
new radio;
metal frame;
metal;
antenna array ... See more keywords
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Published in 2022 at "Micromachines"
DOI: 10.3390/mi13071064
Abstract: In this paper, a highly isolated multiple-input multiple-output (MIMO) antenna array is proposed for fifth-generation (5G) metal frame smartphones. The eight identical small-sized inverted F-shaped folded slots are etched on the metal frame as a…
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Keywords:
antenna;
metal frame;
isolation;
mimo antenna ... See more keywords
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Published in 2025 at "Polymers"
DOI: 10.3390/polym17101301
Abstract: As the demand for smaller and more multifunctional integrated circuit (IC) products increases, system-in-package (SiP) has emerged as a key trend in IC encapsulation. However, the use of polymer-based materials such as epoxy molding compounds…
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Keywords:
shielding metal;
integrated circuit;
behavior void;
metal frame ... See more keywords