Fabrication of Copper Patterns on a Curved Surface by Direct Laser Metallization from Deep Eutectic Solvents
Sign Up to like & getrecommendations! Published in 2025 at "Advanced Engineering Materials"
DOI: 10.1002/adem.202401652
Abstract: In recent years, the fabrication of conductive patterns on curved surfaces with a high‐resolution and low‐cost manner has attracted higher attention both from the scientific community and industry. Numerous studies were on the development of… read more here.
Keywords: curved surface; metallization; surface; copper ... See more keywords
Autocatalytic Metallization of Fabrics Using Si Ink, for Biosensors, Batteries and Energy Harvesting
Sign Up to like & getrecommendations! Published in 2019 at "Advanced Functional Materials"
DOI: 10.1002/adfm.201804798
Abstract: Abstract Commercially available metal inks are mainly designed for planar substrates (for example, polyethylene terephthalate foils or ceramics), and they contain hydrophobic polymer binders that fill the pores in fabrics when printed, thus resulting in… read more here.
Keywords: batteries energy; ink; method; energy harvesting ... See more keywords
Single‐Atom‐Layer Metallization of Plasmonic Semiconductor Surface for Selectively Enhancing IR‐Driven Photocatalytic Reduction of CO2 into CH4
Sign Up to like & getrecommendations! Published in 2024 at "Advanced Materials"
DOI: 10.1002/adma.202413931
Abstract: Efficient harvesting and utilization of abundant infrared (IR) photons from sunlight is crucial for the industrial application of photocatalytic CO2 reduction. Plasmonic semiconductors have significant potential in absorbing low‐energy IR photons to generate energetic hot… read more here.
Keywords: metallization; ch4; co2; atom layer ... See more keywords
Pressure‐Induced Metallization of Lead‐Free Halide Double Perovskite (NH4)2PtI6
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DOI: 10.1002/advs.202203442
Abstract: Metallization has recently garnered significant interest due to its ability to greatly facilitate chemical reactions and dramatically change the properties of materials. Materials displaying metallization under low pressure are highly desired for understanding their potential… read more here.
Keywords: lead free; free halide; nh4 2pti6; pressure ... See more keywords
Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Materials Science"
DOI: 10.1007/s10853-019-04028-z
Abstract: The application of Co-W-P plating technology in high-temperature package structure is advantageous from a point of structural reliability because Co-W-P metallization is known to deliver strong bonding to both high-temperature-compatible Ag-sintered joining and high-temperature-compatible encapsulation… read more here.
Keywords: oxidation resistance; adhesion; resin adhesion; metallization ... See more keywords
Thermo-mechanically induced texture evolution and micro-structural change of aluminum metallization
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-8328-x
Abstract: During operation of high power electronic chips the topside metallization is subjected to cyclic compressive and tensile stresses leading to unwanted thermo-mechanical fatigue of the metallization layer. The stress is caused by the difference in… read more here.
Keywords: thermo mechanically; evolution; induced texture; texture ... See more keywords
Structural Reliability Evaluation of Thermoelectric Generator Modules: Influence of End Conditions, Leg Geometry, Metallization, and Processing Temperatures
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6505-1
Abstract: Structural reliability of thermoelectric generators (TEGs) in medium to high temperature applications still remains a challenge. Currently there are no established standards for evaluating the thermomechanical reliability of TEGs during new material and module development… read more here.
Keywords: processing temperatures; leg geometry; geometry; structural reliability ... See more keywords
Surface Silanization of Polyimide for Autocatalytic Metallization
Sign Up to like & getrecommendations! Published in 2020 at "JOM"
DOI: 10.1007/s11837-020-04286-2
Abstract: Due to its superior chemical stability, mechanical strength, light weight, and flexibility, polyimide (PI) has been widely used as a polymeric substrate of flexible printed circuit boards such as flexible copper clad laminates (FCCLs). The… read more here.
Keywords: silanization polyimide; autocatalytic metallization; metallization; surface silanization ... See more keywords
Efficient metallization of magnetite concentrate by reduction with agave bagasse as a source of reducing agents
Sign Up to like & getrecommendations! Published in 2021 at "International Journal of Minerals, Metallurgy and Materials"
DOI: 10.1007/s12613-020-2079-z
Abstract: The reduction behavior and metallization degree of magnetite concentrate with agave bagasse were investigated in an inert atmosphere. The effects of temperature, biomass content, and residence time on reduction experiments and metallization degree were investigated… read more here.
Keywords: magnetite concentrate; reduction; efficient metallization; agave bagasse ... See more keywords
Completely aqueous route for metallization of structural polymeric materials in micro-electro-mechanical systems
Sign Up to like & getrecommendations! Published in 2019 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2019.02.003
Abstract: Abstract A one-step aqueous diazonium-based process has been proved efficient with respect to the covalent grafting of aminophenyl layers onto KMPR photoresist polymer. In contact with acidic palladium chloride solution for only a few minutes,… read more here.
Keywords: aqueous route; metallization; route metallization; completely aqueous ... See more keywords
A novel metallization process for soldering graphite to copper at low temperature
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2016.12.104
Abstract: Abstract A defect-free Sn-based metallization layer was prepared successfully on the surface of graphite at 950 °C for 30 min using Sn0.3Ag0.7Cu- 9%Cr (wt. %) metal powders. The typical interfacial microstructure of the metallization interface was β-Sn/Cr3C2/graphite.… read more here.
Keywords: graphite copper; novel metallization; process soldering; metallization process ... See more keywords