Articles with "metallization area" as a keyword



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Wear-out Mechanism of Press-pack IGBTs Under Accelerated Aging Test

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Published in 2021 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"

DOI: 10.1109/jestpe.2021.3085590

Abstract: The study of wear-out mechanism of press-pack IGBTs (PPIs) is conducted insufficiently now. In this paper, both the numerical and experimental methods are utilized to investigate the wear-out mechanism of PPIs. After conducting an accelerated… read more here.

Keywords: additional metallization; wear; wear mechanism; metallization area ... See more keywords