A novel metallization process for soldering graphite to copper at low temperature
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DOI: 10.1016/j.jallcom.2016.12.104
Abstract: Abstract A defect-free Sn-based metallization layer was prepared successfully on the surface of graphite at 950 °C for 30 min using Sn0.3Ag0.7Cu- 9%Cr (wt. %) metal powders. The typical interfacial microstructure of the metallization interface was β-Sn/Cr3C2/graphite.… read more here.
Keywords: graphite copper; novel metallization; process soldering; metallization process ... See more keywords