Bonding methods for chip integration with Parylene devices
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DOI: 10.1088/1361-6439/abe246
Abstract: Flexible electronics require more compact interconnects for next-generation devices. Polymer devices can be bonded to integrated circuit chips, but combining flexible and rigid substrates poses unique technical challenges. Existing technologies either cannot achieve the density… read more here.
Keywords: methods chip; chip integration; bonding methods; integration parylene ... See more keywords