Underfill: A Review of Reliability Improvement Methods in Electronics Production
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DOI: 10.3390/polym17162206
Abstract: The increasing integration and miniaturization of electronic devices place serious pressure on packaging technologies to ensure long-term reliability. Polymer underfill encapsulation is a key process for reducing thermomechanical stress in modern assemblies. A systematic analysis… read more here.
Keywords: reliability improvement; methods electronics; underfill review; review reliability ... See more keywords