Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps
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DOI: 10.3390/ma15124297
Abstract: The use of scaled-down micro-bumps in miniaturized consumer electronic products has led to the easy realization of full intermetallic solder bumps owing to the completion of the wetting layer. However, the direct contact of the… read more here.
Keywords: reaction; adhesion; adhesion layer; micro bumps ... See more keywords