Fabrication of n-shaped micro copper structures through localized electrochemical deposition
Sign Up to like & getrecommendations! Published in 2023 at "Journal of Micromechanics and Microengineering"
DOI: 10.1088/1361-6439/acd7f5
Abstract: Localized electrochemical deposition (LECD) is a cost-effective technique for fabricating 3D microstructures. In this study, to fabricate a complete n-shaped micro copper structure, multi-layer deposition was adopted, and the v-groove was removed by an asymmetric… read more here.
Keywords: localized electrochemical; copper; micro copper; deposition ... See more keywords
Effect of aliphatic-amine ethoxy sulfonates (AESS) on micro copper columns fabrication by using localized electrochemical deposition
Sign Up to like & getrecommendations! Published in 2019 at "Materials Research Express"
DOI: 10.1088/2053-1591/ab308e
Abstract: Local electrochemical deposition (LECD) is an economical and efficient three-dimensional (3D) microstructure fabrication method. In this study, micro copper columns were deposited by LECD by using additive aliphatic-amine ethoxy sulfonates (AESS), with a 20μm diameter… read more here.
Keywords: columns; copper columns; micro copper; deposition ... See more keywords
Research on the Effect of Ultrasonic on the Interfacial Reliability of Micro Copper Pillar Solder Joints
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2024.3523295
Abstract: As electronic products continue to develop in the direction of high density and small size, the size of interconnect solder joints continues to decrease. Under normal service conditions, micro solder joints will simultaneously be subjected… read more here.
Keywords: solder; pillar solder; copper pillar; micro copper ... See more keywords