Sub-micro Organosolv lignin as bio-based epoxy polymer component: A sustainable curing agent and additive.
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DOI: 10.1002/cssc.202300076
Abstract: Sub-micro organosolv lignin (OBs) isolated from beechwood biomass, comprising of sub-micro sized particles (570 nm), with low molecular weight (Mw) and dispersity (Ð), and relatively high total phenolic -OH content, was successfully utilized for the… read more here.
Keywords: sub micro; organosolv lignin; epoxy polymer; micro organosolv ... See more keywords