Al–NiO energetic composites as heat source for joining silicon wafer
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Materials Processing Technology"
DOI: 10.1016/j.jmatprotec.2019.116572
Abstract: Abstract Silicon wafers with the thickness of approximately 250 μm were joined successfully using Al/NiO nano-thermite composites and with an aluminum foil interlayer (thickness of 30 μm), due to energy production from the exothermic reaction… read more here.
Keywords: energy; micro powder; nano thermite; reaction ... See more keywords
Design of trimodal Fe micro-nanopowder feedstock for micro powder injection molding
Sign Up to like & getrecommendations! Published in 2017 at "Powder Technology"
DOI: 10.1016/j.powtec.2017.04.051
Abstract: Abstract The design of the trimodal powder feedstock and its feasibility for micro powder injection molding (μ-PIM) were investigated. The feedstock was prepared by mixing Fe micropowder (D 50 = 4 μm) and nanopowder agglomerate composed of… read more here.
Keywords: design trimodal; feedstock; micro powder; powder ... See more keywords