Effects of Micro Solder Joint Geometry on Interfacial IMC Growth Rate
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DOI: 10.1007/s11664-017-5344-9
Abstract: The effects of micro solder joint geometry on intermetallic compound (IMC) growth and electromigration during thermal aging and current stressing have been investigated using three groups of specimens: sandwich structure with solder layer of 10 μm… read more here.
Keywords: micro solder; solder joint; geometry; solder ... See more keywords
Interfacial reactions in molten state micro solder joints under current stressing
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2017.12.284
Abstract: Abstract The high local temperature in flip-chip solder joints of microprocessors has raised concerns that the solder, a low melting temperature alloy, might locally liquefy and consequently cause failure of the micro solder joint. This… read more here.
Keywords: solder joints; micro solder; solder; state micro ... See more keywords