Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects
Sign Up to like & getrecommendations! Published in 2022 at "Micromachines"
DOI: 10.3390/mi13122081
Abstract: With the growing demands for transferring large amounts of data between components in a package, it is required for advanced packaging technologies to form smaller vertical vias in the insulators. Plasma etching is one of… read more here.
Keywords: vias; fabrication; micro vias; polyimide ... See more keywords