IMC suppression and phase stabilization of Cu/Sn-Bi/Cu microbump via Zn doping
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DOI: 10.1016/j.matlet.2020.128735
Abstract: Abstract For the advanced 3D-IC application, warpage and low thermal budget requires low temperature soldering for microbumps. Sn-Bi-Zn low temperature solder was studied for its low cost and accessibility. By doping Zn and adding Sn… read more here.
Keywords: phase stabilization; imc suppression; suppression phase; microbump via ... See more keywords