IEEE-CPMT Special Topic: Advances in Tools/Techniques for Microelectronic Package Failure Analysis
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DOI: 10.1109/tcpmt.2018.2828219
Abstract: Recent advances in microelectronic package technologies such as 2.5-D, 3-D, and wafer-level packaging have delivered rapid breakthroughs in the semiconductor industry by providing better device performance, power efficiency, and cost reduction. Reduction of feature sizes… read more here.
Keywords: microelectronic package; tools techniques; special topic; failure ... See more keywords