Thermomechanical properties and fatigue life evaluation of SnAgCu solder joints for microelectronic power module application
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DOI: 10.1016/j.jmrt.2020.03.078
Abstract: Abstract In this paper, a new constitutive model of SnAgCu lead-free solder, which covered the low-temperature and elevated-temperature creep properties, was constructed according to the thermomechanical property test under a wide range of temperatures (−40… read more here.
Keywords: power module; microelectronic power; power; model ... See more keywords