Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2020.156043
Abstract: Abstract Copper pastes suitable for low temperature and low pressure die-attach bonding were developed to enable sintering at 275 °C under N2 atmosphere. First, brass flakes were treated with HCl to selectively etch Zn and to… read more here.
Keywords: novel approach; surface; brass; copper ... See more keywords
A Review of Low-Temperature Solders in Microelectronics Packaging
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2023.3271269
Abstract: The shift to lead-free solder alternatives led to the development of Sn–Ag–Cu (SAC) alloys as the most used solders due to their superior mechanical properties and reliability. However, their melting range (217 °C–222 °C) is… read more here.
Keywords: based solders; temperature solders; low temperature; review ... See more keywords