Fabrication of mechanically reliable micrometric scale conductive pattern by direct pattern transfer using UV photopolymer penetration
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DOI: 10.1088/1361-6439/abd8e1
Abstract: A mechanically reliable micrometric scale conductive wire fabrication method was developed using silver paste. In order to increase the bonding strength between silver particles, a method was developed for filling the space between particles with… read more here.
Keywords: pattern; penetration; paste; micrometric scale ... See more keywords