Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices
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DOI: 10.1021/acsanm.0c02182
Abstract: Improving the interface stability for nanosized thin films on brittle substrates is crucial for technological applications such as microelectronics because the so-called brittle–ductile interfaces limit their overall reliability. By tuning the thin film properties, interface… read more here.
Keywords: adhesion; microstructural effects; glass substrates; film ... See more keywords