Communication—Triphenylmethane-Based Leveler for Microvia Filling in Copper Super-Conformal Electroplating
Sign Up to like & getrecommendations! Published in 2019 at "Journal of The Electrochemical Society"
DOI: 10.1149/2.0531913jes
Abstract: Levelers exhibiting high microvia-filling power and wide operating-concentration ranges are required for the development of additives in copper super-conformal electroplating. In this study, a novel structure based on triphenylmethane (TPM-1) was synthesized and investigated as… read more here.
Keywords: microvia filling; microvia; super conformal; conformal electroplating ... See more keywords
A Green and Facile Microvia Filling Method via Printing and Sintering of Cu-Ag Core-Shell Nano-Microparticles
Sign Up to like & getrecommendations! Published in 2022 at "Nanomaterials"
DOI: 10.3390/nano12071063
Abstract: In this work, we developed an eco-friendly and facile microvia filling method by using printing and sintering of Cu-Ag core-shell nano-microparticles (Cu@Ag NMPs). Through a chemical reduction reaction in a modified silver ammonia solution with… read more here.
Keywords: microvia filling; microvia; printing sintering; filling method ... See more keywords