Passive intermodulation model and experimental verification of cascaded microwave devices
Sign Up to like & getrecommendations! Published in 2017 at "International Journal of Microwave and Wireless Technologies"
DOI: 10.1017/s1759078717000186
Abstract: Passive intermodulation (PIM) is a complex problem in high-power microwave devices and satellite communications. In this paper, an effective calculation method is proposed for predicting PIM power levels of the cascaded microwave devices. First of… read more here.
Keywords: microwave devices; model; cascaded microwave; passive intermodulation ... See more keywords
Sub-kelvin thermometer for on-chip measurements of microwave devices utilizing two-level systems in superconducting microresonators
Sign Up to like & getrecommendations! Published in 2020 at "Applied Physics Letters"
DOI: 10.1063/5.0029351
Abstract: We present a superconducting microresonator thermometer based on two-level systems (TLSs), which is drop-in compatible with cryogenic microwave systems. The operational temperature range is 50–1000 mK (which may be extended to 5 mK), and the… read more here.
Keywords: two level; thermometer; level systems; cryogenic microwave ... See more keywords
Suppressing the Multipactor in Microwave Devices by Introducing the Dielectric Material
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Electron Devices"
DOI: 10.1109/ted.2025.3588521
Abstract: This study proposes a method for suppressing the multipactor effect in high-power microwave devices for spacecraft applications by integrating dielectric materials. Electromagnetic fields are numerically analyzed using the CST Microwave Studio, while multipactor thresholds are… read more here.
Keywords: multipactor microwave; multipactor; microwave devices; electric field ... See more keywords
Low Cost Metallization of Microwave Devices Implemented with 3D Printers
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Latin America Transactions"
DOI: 10.1109/tla.2018.8795125
Abstract: In the present paper, several techniques for microwave devices metallization made by 3D printing are analyzed with the aim of developing a low-cost process. Our goal is to define the best technique for making passive… read more here.
Keywords: cost metallization; microwave devices; low cost; cost ... See more keywords
Residue-Pole Methods for Variability Analysis of S-parameters of Microwave Devices with 3D FEM and Mesh Deformation
Sign Up to like & getrecommendations! Published in 2020 at "Radioengineering"
DOI: 10.13164/re.2020.0010
Abstract: This paper presents a new approach for variability analysis of microwave devices with a high dimension of uncertain parameters. The proposed technique is based on modeling an approximation of system by its poles and residues… read more here.
Keywords: microwave devices; variability analysis; mesh deformation;
Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices
Sign Up to like & getrecommendations! Published in 2023 at "Crystals"
DOI: 10.3390/cryst13040631
Abstract: Due to its higher energy and smaller heating area, laser joining technology is widely used in aluminum alloy welding and other industrial fields, which meets the solder sealing requirements for electronic packaging. According to experiments,… read more here.
Keywords: spot; aluminum alloy; laser joining; spot welding ... See more keywords