Stress induced migration of grain boundaries in Cu-bicrystals
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DOI: 10.1080/09500839.2019.1704902
Abstract: ABSTRACT Stress induced migration of tilt grain boundaries with misorientation angles 13.5°, 57.5° and 70.4° in high-purity Cu bicrystals was investigated by in situ observations in a scanning electron microscope. The investigated boundaries moved steadily… read more here.
Keywords: migration grain; stress induced; migration; induced migration ... See more keywords