A Ku-Band Miniaturized System-in-Package Using HTCC for Radar Transceiver Module Application
Sign Up to like & getrecommendations! Published in 2022 at "Micromachines"
DOI: 10.3390/mi13111817
Abstract: This paper introduces a miniaturized system in package (SIP) for a Ku-band four-channel RF transceiver front-end. The SIP adopts the packaging scheme of an inner heat-dissipation gasket and multi-layer substrate in the high temperature co-fired… read more here.
Keywords: system package; transceiver; radar transceiver; miniaturized system ... See more keywords