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Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-9896-0
Abstract: The ionic residues of activator compounds used in the no-clean solder flux systems often remain on a Printed Circuit Board Assembly surface after the soldering process and may compromise the corrosion reliability of electronic device…
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Keywords:
humidity related;
binary mixtures;
weak organic;
mixtures weak ... See more keywords