GaN MMICs on a diamond heat spreader with through-substrate vias fabricated by deep dry etching process
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DOI: 10.35848/1882-0786/ac5222
Abstract: GaN monolithic microwave integrated circuits (MMICs) on a diamond heat spreader were successfully fabricated and demonstrated. The diamond was bonded to the back-side surface of the GaN on SiC devices by atomic diffusion bonding. In… read more here.
Keywords: diamond heat; heat spreader; substrate vias; diamond ... See more keywords