High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects
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DOI: 10.1109/tcpmt.2017.2741340
Abstract: A novel $\pi $ -type equivalent-circuit model of through-silicon vias (TSVs) for 3-D integrated circuits (3-D ICs) considering eddy current and proximity effects is proposed in this paper. The numerical models for the serial resistance… read more here.
Keywords: silicon vias; frequency; model; tex math ... See more keywords