Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles
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DOI: 10.1021/acsami.2c21229
Abstract: Semiconductor packaging continues to reduce in thickness following the overall thinning of electronic devices such as smartphones and tablets. As the package becomes thinner, the warpage of the semiconductor package becomes more important due to… read more here.
Keywords: packaging; modified cure; cure; package ... See more keywords