A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
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DOI: 10.1109/jestpe.2019.2951801
Abstract: Power module packaging technologies have been experiencing extensive changes as the novel silicon carbide (SiC) power devices with superior performance become commercially available. This article presents an overview of power module packaging technologies in this… read more here.
Keywords: module packaging; packaging technologies; power module; packaging ... See more keywords