Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2018.2805873
Abstract: The mechanical/optical configuration of moiré interferometry for real-time observation of thermal deformations is advanced to quantify the thermomechanical behavior of fan-out wafer level packages (FO-WLPs). Two most notable advancements are on the: 1) mechanical front:… read more here.
Keywords: package; moir interferometry; real time; configuration ... See more keywords