Interfacial evolution in Sn–58Bi solder joints during liquid electromigration
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-8907-5
Abstract: For Sn–58Bi low temperature solder alloy, local molten induced from electromigration Joule heating might change the atomic diffusion and interfacial behavior. In this paper, the diffusion behavior and interfacial evolution of Cu/Sn–58Bi/Cu joints were studied… read more here.
Keywords: interfacial evolution; electromigration; molten solder; solder ... See more keywords
A 3D numerical study of a molten solder droplet's wetting and solidifying on a pillar with application to electronic packaging
Sign Up to like & getrecommendations! Published in 2020 at "International Journal of Heat and Mass Transfer"
DOI: 10.1016/j.ijheatmasstransfer.2020.119585
Abstract: Abstract The 3D problem of spreading and solidification of a molten solder droplet (with a melting temperature of Tm and a radius of Rd) on a circular pillar (with a radius Rpillar and a height… read more here.
Keywords: temperature; contact angle; droplet; molten solder ... See more keywords