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Published in 2024 at "Advanced Materials Interfaces"
DOI: 10.1002/admi.202400558
Abstract: Molybdenum (Mo) has a high potential of becoming the material of choice for sub‐10 nm scale metal structures in future integrated circuits (ICs). Manufacturing at this scale requires exceptional precision and consistency, so many metal…
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Keywords:
molybdenum interconnects;
plasma oxidation;
metal;
digital etching ... See more keywords