In Situ Monitoring Bonding Wires Fatigue in IGBT Power Modules Using Differential Mode Impedance Extracted From Dual Current Probe Technology
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DOI: 10.1109/tim.2025.3551980
Abstract: Bonding wires fatigue is a common fatigued mode of power modules, and in situ monitoring of bonding wires fatigue in insulate-gate bipolar transistor (IGBT) modules is highly efficient and economical for improving reliability. In this… read more here.
Keywords: bonding wires; current probe; wires fatigue; dual current ... See more keywords