Monitoring the curing process of epoxy adhesive using ultrasound and Lamb wave dispersion curves
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DOI: 10.1016/j.ymssp.2020.107397
Abstract: Abstract Monitoring the stiffness of adhesives is a crucial issue when considering the durability and strength of adhesive joints. While there are many studies conducted on specimens made only from adhesive, the problem of curing… read more here.
Keywords: monitoring curing; epoxy adhesive; adhesive using; curing process ... See more keywords