Topological Metal MoP Nanowire for Interconnect
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DOI: 10.1002/adma.202208965
Abstract: The increasing resistance of copper (Cu) interconnects for decreasing dimensions is a major challenge in continued downscaling of integrated circuits beyond the 7 nm technology node as it leads to unacceptable signal delays and power… read more here.
Keywords: nanowire interconnect; mop nanowire; metal mop; topological metal ... See more keywords