An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics
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DOI: 10.3390/mi13040583
Abstract: Printing technology and mounting technology enable the novel field of hybrid printed electronics. To establish a hybrid printed system, one challenge is that the applied mounting process meets the requirements of functional inks and substrates.… read more here.
Keywords: room temperature; process; mounting process; hybrid printed ... See more keywords