Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6335-1
Abstract: The electroless nickel immersion gold process often produces defects, such as pinholes and black pads that can cause brittle fractures at the interface between the solder and metal pad. Contamination in electroless Ni plating solutions… read more here.
Keywords: mto; plating solutions; mto solutions; electroless plating ... See more keywords