Multi-chip front-end electronics LYRA for X and γ Ray detector for HERMES mission
Sign Up to like & getrecommendations! Published in 2021 at "Journal of Instrumentation"
DOI: 10.1088/1748-0221/16/12/t12013
Abstract: We present the experimental results of the Application Specific Integrated Circuit (ASIC), called LYRA, specifically designed for the High-Energy Rapid Modular Ensemble of Satellites (HERMES) mission concept, a constellation of nano-satellites able to detect and… read more here.
Keywords: front end; lyra; energy; multi chip ... See more keywords
A 0.32–128 TOPS, Scalable Multi-Chip-Module-Based Deep Neural Network Inference Accelerator With Ground-Referenced Signaling in 16 nm
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Journal of Solid-State Circuits"
DOI: 10.1109/jssc.2019.2960488
Abstract: Custom accelerators improve the energy efficiency, area efficiency, and performance of deep neural network (DNN) inference. This article presents a scalable DNN accelerator consisting of 36 chips connected in a mesh network on a multi-chip-module… read more here.
Keywords: neural network; inference; deep neural; chip ... See more keywords
The effectiveness of MgCeAl11O19:Tb3+ phosphor in enhancing the luminous efficacy and color quality of multi-chip white LEDs
Sign Up to like & getrecommendations! Published in 2020 at "International Journal of Electrical and Computer Engineering"
DOI: 10.11591/ijece.v10i5.pp4631-4638
Abstract: In this research paper, we introduced yellow-green MgCeAl11O19:Tb3+ asa new phosphor ingredient to adapt to the quality requirements onthe chromatic homogeneity and emitted luminous flux of modern multi-chip white LED lights (MCW-LEDs). The results from… read more here.
Keywords: tb3 phosphor; mgceal11o19 tb3; tb3; multi chip ... See more keywords
Research on Heat Dissipation of Multi-Chip LED Filament Package
Sign Up to like & getrecommendations! Published in 2021 at "Micromachines"
DOI: 10.3390/mi13010077
Abstract: By studying the substrate material, structure, chip distribution, and array form of the multi-chip light-emitting diode (LED) package, the heat-dissipation capacity of the LED package is improved. Finite element analysis and steady-state thermal analysis are… read more here.
Keywords: chip; heat dissipation; package; multi chip ... See more keywords