Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process
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DOI: 10.3390/ma15051683
Abstract: This paper focuses on characterizing the evolution of warpage, effects of epoxy molding compound (EMC), and effects of carrier 2 (the second carrier in the process) of 12 inch RDL-first multi-die fan-out wafer-level packaging (FOWLP)… read more here.
Keywords: multi die; warpage; carrier; fan wafer ... See more keywords