Al–NiO energetic composites as heat source for joining silicon wafer
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DOI: 10.1016/j.jmatprotec.2019.116572
Abstract: Abstract Silicon wafers with the thickness of approximately 250 μm were joined successfully using Al/NiO nano-thermite composites and with an aluminum foil interlayer (thickness of 30 μm), due to energy production from the exothermic reaction… read more here.
Keywords: energy; micro powder; nano thermite; reaction ... See more keywords